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Webinar: AI at the Tactical Edge: Protecting Machine Learning with Data Security
Artificial intelligence (AI) informed by compromised data can lead soldiers into contested territory, flag an innocent civilian as dangerous or prevent a passenger jet from landing safely. Machine learning at the edge requires big data processing and actionable, real-time intelligence, but data in the field can be lost, stolen or exploited. Mercury Systems and Intel are working together to design secure AI edge solutions to protect data and machine learning in the field. Join us to learn more about: The importance of data and model quality Types of data bias and why data integrity is critical Model and data security techniques for learning assurance Strengthening edge cybersecurity with built-in hardware security
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Webinar: Overcoming Memory Design Challenges in High-Performance Edge Computing
From modern military aircraft to industrial drilling, an increasing number of applications are demanding high-performance computing in harsh environments. These edge computing systems maximize data efficiency and reduce latency by performing the processing at the sensor, instead of a remote data center. However, designing for the edge introduces new challenges. In this webinar we present an overview of how to address some of the challenges related to high-speed memory for edge applications. As these applications require more processing in smaller spaces, poorly designed memory modules can limit system performance. Advanced processing requires denser and higher performance memory, which presents several challenges at the tactical edge. More functionality is needed in smaller spaces. Reliable performance is required at the tactical edge. There must be the ability for decade-long program support. Secure and trusted supply chains are essential. Find out how these design challenges are solved with modern packaging techniques for the most demanding application requirements.
May 5, 2021
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Webinar: Accelerating Defense Microelectronics through Our Digital Transformation
In this webinar, we will discuss four decades of innovative 2D and 2.5D microelectronics packaging and integration and how it supports engineering design with digital thread, then review the latest trends in advanced microelectronics.
May 5, 2021
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