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ENSEMBLE® 3000 Series HCD3210 High Compute Density OpenVPX FPGA

Product Description

The Ensemble® 3000 Series HCD3210 3U OpenVPX™ (VITA 65) Processing Module from Mercury Computer Systems is a single-slot solution for data acquisition and processing. By combining the performance logic of a highly capable Xilinx® Virtex™-6 FPGA with the real-time processing power of a Freescale™ MPC8640D dual-core processor, the HCD3210 supports multi-stage processing for many applications. The addition of the HCD3210’s XMC mezzanine site delivers I/O to these powerful processing elements, supporting a singleslot high-performance processing architecture for size, weight, and power (SWaP)-constrained platforms. The multi-plane OpenVPX architecture of the HCD3210 also allows users to scale, knitting together multiple HCD3210s into a powerful processing subsystem.
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  • General-purpose processing via dual-core MPC8640D processor running at 1.06 GHz, supported 1 GB of DDR2 SDRAM 
  • Xilinx ® Virtex ™-6 FPGA supported by two 9-MB banks of QDRII SRAM and 128 MB of DDR3-900M SDRAM 
  • High-bandwidth communications, including native support for RapidIO and PCI Express® (PCIe) 
  • XMC site supported by PCI Express (PCIe) per VITA 42.3 
  • IPMI controller for system management functions 
  • MultiCore Plus® software environment with MC SAL
  • High-bandwidth off-board and on-board data paths
  • Single slot solution for data acquisition and multi-stage processing 
  • Rugged versions for harsh environments 
  • Identical software architecture across Mercury products
  • Designed and architected for OpenVPX™ interoperability

Form Factor: 3U OpenVPX
OpenVPX Module Profile: MOD3-PAY-1F2F2U

FPGA Compute Node Xilinx Virtex-6 (LX365T default): 1
QDRII SRAM (200 MHz clock): Two 9-MB banks
DDR3-900M SDRAM: 128 MB

General Purpose Processor Dual-core MPC8640D: At 1.06 GHz
Cores per device: 2
DDR2 SDRAM: 1 GB at 533 MHz

XMC Mezzanine Site XMC sites: 1
PCI Express XMC site per VITA 42.3
XMC user I/O to on-board FPGA

Data/Control/Management/Expansion Planes Data plane
     One x4 serial RapidIO link to backplane from
          MPC8640D processor 
               Confi gurable as PCI Express, if required
Expansion plane
     One x8 PCI Express interface to backplane from PCIe switch 
     User confi gurable to dual x4 interfaces
Control plane 
     Two 1000BASE-BX Gigabit Ethernet interfaces to the backplane
Management plane 
     I2C interface to backplane running IPMI protocol

Off-board Communications x4 SERDES interfaces to backplane from FPGA: 2
LVDS pairs to backplane from FPGA: 12
RS-232 serial interface to 8640D processor: 1

System Management On-board IPMI Controller
Voltage and temperature monitor
Geographical address monitor
Power/reset control
FRU and on-board EEPROM interfaces
FPGA, CPU, and CPLD interfaces

Additional Resources Real-time clock
Watchdog timer
General-purpose 32-bit timers/counters

Environmental
Air-Cooled – Commercial
Temperature 
     Operating: 0°C to 40°C* 
     Storage: -40°C to +85°C 
     *Customer must maintain required cfm level.
Humidity 
     Operating: 10-95%, non-condensing
Vibration: 0.003 g2/Hz; 20-2000 Hz, 1 hr/axis
Shock: 20g, z-axis; 32g, x-, y-axes; 11 ms half-sine pulse
Altitude 
     Operating: 0-10,000 ft* 
     *Customer must maintain required cfm level.

Conduction-Cooled – Mercury Rugged Level 3 Temperature 
     Operating: -40°C to +71°C at the card edge* 
     Storage: -55°C to +125°C 
     *Customer chassis must maintain card edge at 71°C.
Humidity 
     Operating: 0-100%
Vibration: 0.1 g2/Hz, based on 5-2000 Hz, 1 hr/axis
Shock: 50g, z-axis; 80g, x-, y-axes; 11 ms half-sine
Altitude 
     Operating: 0-70,000 ft