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ENSEMBLE® 6000 Series HDS6600 High Density Server OpenVPX Xeon-EP

Product Description

The Ensemble® 6000 Series OpenVPX (VITA 65) Intel Xeon Dual Quad-Core HDS6600 Module is a high-density signal and data processing engine, harnessing of the latest generation of server-class Nehalem-based quad-core Intel® Xeon® processors for the most demanding applications. The HDS6600 is equipped with a next-generation FPGA for fabric bridging/switching and user application functions, and provides high-bandwidth on-board and off-board communication fabrics in a standard 6U OpenVPX™ form factor.

By leveraging the power of Intel high-density Xeon processing in combination with the on-board integrated high-performance PCI Express® and fabric infrastructure, the HDS6600 delivers a well balanced and scalable computing architecture, capable of providing groundbreaking levels of processing power for high-end radar, signals intelligence, and image and packet processing applications.
  • Features
  • Benefits
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  • Two 64-bit Xeon Nehalem-class quad-core Jasper Forest LC5518 processors 
  • Utilizes unique packaging technologies to support two instances of a Land Grid Array (LGA) processor in a rugged embedded platform 
  • Dual quad-core processors ae linked via the high-speed low-latency QPI interface with 19.26 GB/s transfer rate 
  • Each processor can deliver approximately 55 GFLOPS (peak) with three high-speed DDR3-1066 memory channels capable of 17 GB/s raw bandwidth each, for a total peak of 110 GFLOPS and 51 GB/s of raw memory bandwidth 
  • Supports configurations with 12 to 24 GB of DDR3 SDRAM on-board 
  • High-end 80-lane PCI Express switch for on-board switching and off-board expansion 
  • Variety of additional built-in I/O options 
  • Thermal and voltage sensors integrated on-board 
  • Real-time clock with granularity to 1 ms and time measurement of up to 30 years 
  • General-purpose timers for synchronization 
  • Watchdog timer to support interrupt or reset 
  • Multiple boot paths, include netboot, USB boot, and boot from SATA or the on-board 2-GB fl ash device
  • Industry-leading performance for rugged Intel® signal processing 
  • 6U OpenVPX™-compliant VITA 65/46/48 (VPX-REDI) module 
  • Two quad-core Intel Xeon® processors at 1.73 GHz for total of 110 GFLOPS peak 
  • Includes POET™, Mercury’s protocol-agnostic, multi-standard switch-fabric technology 
  • Integrated 80-lane PCI Express® switching infrastructure for on-board and off-board co-processing expansion-plane communications 
  • MultiCore Plus® software infrastructure support

Intel® 45-nm Nehalem-Class ProcessorQuad-core LC5518 Jasper Forest 2 at 1.73 GHz each
    Peak performance: 55 GFLOPS
    Threads per core: 2
QPI interface between processors 25.6 GB/s peak performance
    Intel® Virtualization Technology
Integrated x16 Gen2 PCI Express interface
DDR3-1066: 12 GB with ECC (up to 24 GB future capability)
    Raw memory bandwidth: 51 GB/s
BIOS SPI flash: 8 MB
NAND flash: 2 GB  

Altera Stratix® IV EP4SGX180 Field-Programmable Gate Array (FPGA)Logic elements: 175,000
Internal memory :11.7 Mb
18x18 multipliers: 920
16 SerDes: 600 Mbp to 6.25 Gbps per SerDes
High-performance 184 GMACs: 200 MHz
DDR3 SDRAM: Up to 128 MB 1066 MT/s
Provides fabric bridging to data plane
Can act as co-processor executing iFFT/FFT, image or signal processing
Configured from CPU or dedicated configuration ROM

Ethernet Connections
1000BASE-BX Ethernet to P4 connector :2
    OpenVPX Control Plane
10/100/1000BASE-T Ethernet to P4 connector: 1
    Accessible via OpenVPX RTM or external chassis interface
10/100/1000BASE-T Ethernet connection: 1
    to front panel (air-cooled module)
    or backplane (conduction-cooled module)
Ethernet functions supported by the chipset include:
    UDP, TCP, SCTP, ARP, IPv4, IPv6, IEEE1588,
    flow control, 802.1P (priority), and 802.1Q (VLAN)

IPMI (System Management)
On-board IPMI controller
Voltage and temperature monitor
Geographical address monitor
Power/reset control
FRU and on-board EEPROM interfaces
FPGA, CPU, and CPLD interfaces

OpenVPX Multi-Plane Architecture
System Management via IPMB-A and IPMB-B link on P0
    management plane
Dual 4x serial RapidIO or 10 Gigabit Ethernet interfaces on
    P1 data plane
Full x16 or dual x8 PCIe expansion plane
Dual 1000BASE-BX Ethernet control plane

Additional I/O CapabilitiesRS-232 serial interface to front panel: 1
    (air-cooled) or backplane (conduction-cooled)
    Configurable for RS-422 signalling when routed to backplane
Front-panel USB 2.0 interface :1
    (air-cooled confi gurations only)
USB 2.0 interfaces to backplane: 2
SATA interfaces to backplane: 2
Single-ended GPIO interfaces to backplane: 8
System signals to backplane
NVMRO, ChassisTest, Environmental Bypass, MemoryClear

Mechanical
6U OpenVPX (air-cooled and conduction-cooled)
1.0” slot pitch
OpenVPX and VPX REDI

Environmental 

Air-Cooled – Mercury Rugged Level 1
Temperature
    Operating: -25°C to +55°C*
    Storage: -55°C to +85°C
*Customer must maintain the required cfm level.
Humidity
    Operating: 5-95%, non-condensing
Vibration: 0.04 g2/Hz; 20-2000 Hz; 1 hr/axis
Shock: 50g z-axis; 80g x-, y-axis; 11 ms half-sine
Altitude
    Operating 0-30,000 ft*
*Customer must maintain the required cfm level.

Conduction-Cooled – Mercury Rugged Level 3
Temperature
    Operating: -40°C to +71°C at the card edge
    Storage: -55°C to +125°C
Humidity
    Operating: 0-100%
Vibration :0.1 g2/Hz, based on 5-2000 Hz, 1 hr/axis
Shock :50g z-axis; 80g x-, y-axis; 11 ms half-sine
Altitude: 0-70,000 ft*
*Customer chassis must maintain card edge at 71°C.

Specification Compliance
OpenVPX System Specification encompasses:
    VITA 46.0, 46.3, 46.4, 46.6, 46.11, and VITA 48.1, 48.2 (REDI)
Serial RapidIO, PCI Express, 10 Gigabit Ethernet