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ENSEMBLE® 8000 Series HDS8613 High Density Server AdvancedTCA Xeon-EP

Product Description

HDS8613 Processing Blade 

Most powerful single slot Intel server-class processing power for advanced radar, IMINT, and other compute-intense applications  

The Ensemble® HDS8613 high density server (HDS) is a next-generation secure AdvancedTCA™ blade with dual 12-core processors. The blade is equipped with native Advanced Vector Extensions 2 (AVX2) and full Intel Quick Path Interconnect (QPI) with the support of up to 128GB DDR4-2133 SDRAM to deliver a combined 1.38 TFLOPS of general-purpose processing power. The blade supports multiple system integrity solutions and is equipped with an AMC mezzanine site for the broadest system integration versatility available.

The Ensemble® HDS8613 has ruggedization and cooling enhancements inherited from its OpenVPX pedigree. Mercury’s secure ATCA Ensemble® portfolio leverages best commercial technology from the industrial base to support the U.S. Department of Defense's Better Buying Power requirements for open system architectures, affordability and exportability.

  • Features
  • Benefits
  • Specs
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  • Dual Intel® 1.8GHz 12-core Xeon® (with Haswell architecture) server-class processors
  • 1.38 TFLOPS peak processing power
  • 40 Gigabit Ethernet or InfiniBand high bandwidth fabric interfaces
  • AMC mezzanine site for I/O or storage configurability
  • PCIe connectivity to rear transition
  • Up to 128 GB DDR4-2133 SDRAM
  • Leveraged technology from 6U OpenVPX Ecosystem
  • Next-generation Ensemble® secure AdvancedTCA is the union of the best commercial and embedded processing technologies that delivers affordable cloud processing for the tactical edge with system integrity
  • Ideally suited to compute-intense sensor processing chain applications in the radar, EW, mission systems and EO/IR domains

Processors 

  • Dual Intel 1.8GHz 12-core E5-2648L v3 (Wellsburg Bridge) server-class processors
  • Haswell architecture with Fused Multiple-Add and AVX2
  • Peak performance 1.38 TFLOPS
  • Threads per core 2
  • QPI interface between processors
  • 38 GB/s bi-directional (76 GB/s between processors)
  • Dual Integrated x16 Gen3 PCIe interface

  

Memory 

  • Up to 128GB DDR4-2133 with ECC
  • Raw memory bandwidth: 68 GB/s per processor

  

BIOS 

  • SPI flash: Dual 16 MB partitions
  • NAND flash: 8 GB, SATA interface

  

Data Plane PCIe to Switched Fabric Bridge  

  • Mellanox ConnectX-3 VPI host adapter
  • Support DDR/QDR/FDR10 InfiniBand or 40 Gigabit Ethernet protocols

  

Mechanical and power 

  • 8U AdvancedTCA™ PICMG 3.0
  • 1.2” slot pitch
  • Power consumption:
  • ~75W per processor
  • ~200W per module