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PowerStream 7000 FCN Module

Product Description

The PowerStream® 7000 FPGA compute node (FCN) module provides a flexible, manageable way to exploit the power of field-programmable gate arrays (FPGAs) in PowerStream 7000 multicomputer systems. The FCN provides massive I/O as part of a scalable system that can expand with minimal application recoding and expense. Because some algorithms can run up to 20 times faster on an FPGA than a RISC processor, developers can partition applications across FPGAs and RISC processors for maximum effectiveness.
The FCN module supports three Xilinx® Virtex-II ProTM  P70-6 FPGAs. Each 7-million gate FPGA is connected to the RapidIO® switch fabric via an onboard RapidIO crossbar. Each FPGA is supported by both local SRAM and local DRAM to maximize its effectiveness.
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  • Benefits
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  • 3 fully integrated FPGA compute nodes
  • Two 10-Gpbs full-duplex fiber-optic connections
  • 24 LVDS pairs through the front panel
  • Three Xilinx Virtex-II Pro P70-6 FPGAs
  • 32-MB QDR II SRAM in each FCN
  • 175-MHz clock frequency (DDR 350)
  • 128-MB RLDRAM II in each FCN
  • RapidIO switch fabric
  • FPGA Developer's Kit (FDK)
  • Exploit the power of FPGAs in PowerStream 7000 systems
  • Flexible, high-capacity I/O connections
  • Built-in IP for RapidIO and memory control
  • Real-time reconfiguration for mode changes
  • Partition applications easily between FPGAs and PowerPCs
  • Systems scale with minimal application recoding and redeployment expense

Module  

FPGA compute nodes: 3
FPGA processor: Xilinx XC2VP70-6
SRAM
   Capacity per FPGA: 32 MB
   Bandwidth per FPGA: 5.6 GB/s full-duplex (peak)
DRAM
   Capacity per FPGA: 128 MB
   Bandwidth per FPGA: 2.8 GB/s (peak)
Parallel RapidIO ports per FPGA: 1
Fiber links
   2 pairs at 10 Gbaud each, full-duplex (1 on each of 2 FPGAs)
   850 nm multi-mode fiber with LC connectors
Copper serial links per FPGA
   5 at 3.125 Gbaud to each other onboard FPGA, full-duplex
   4 at 3.125 Gbaud off-board
   (12 total to front panel)
LVDS lines per FPGA
   8 pairs to two front-panel connectors
   (24 pairs total)

Electrical/Mechanical
Input voltage
   48 VDC
   5V (for system management)
Input voltages measured at the backplane pins inclusive of all ripple.
Mercury strongly recommends that system-level power designs use a ±2% margin to avoid any potential issues with respect to the system-level operating characteristics and operating environment.

Power: 190W (typical max, depends largely on application IP)
Dimensions: M155 format
Slot spacing: 1.057 in

Environmental
Minimum airflow* (per slot at sea level)
28 CFM per stacked pair
Temperature*
   Operating: 0°C to 35°C (stacked pair, sea level)
Storage: -55°C to +85°C
Rate of change: 5°C/min
Humidity: 5-95% (non-condensing)
Vibration
   Random: 0.02g²/Hz, based on 20 to 2,000 Hz, 1 hr/axis
Shock: 50g in all axes, 11 msec, half-sine
Altitude*
   Operating: 0 to 30,000 ft
   Storage: 0 to 50,000 ft
   Salt/Fog: Consult factory

*As altitude increases, air density decreases and, therefore, the cooling effect of a particular number of CFM decreases. Different limits can be achieved by trading among altitude, temperature, performance, and airflow. Contact Mercury for more information.