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Enabling edge processing with stacked, high-speed DDR4 and DDR5 memory

In military environments, seconds can be the difference between mission success or failure and life or death. System malfunction or failure due to poor signal integrity within integrated circuits and embedded board designs leads to catastrophic events. 

The problems are stacking up

The complexity of die stacking and wire bonding increases with each additional die needed to design high-density memory, such as a single 16GB DDR4 device or a custom multi-chip module (MCM) device. With so many circuits in a tightly stacked configuration, signal integrity is at the forefront of design considerations. 

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Dual Redundant Display in Bubble Canopy Applications
Dual Redundant Display in Bubble Canopy Applications

This paper investigates both the large area display architecture with available options to solve redundancy...

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The Military Digital Convergence - enables next-generation military platforms
The Military Digital Convergence - enables next-generation military platforms

Military digital transformation enables platforms to shrink and become more capable and adaptable for missi...

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