Technology innovations for high-volume, consumer applications continue to evolve at an accelerating pace. While these innovations deliver extraordinary performance at incredibly low price points for end users, the enabling technologies must be carefully scrutinized for applicability in military application scenarios. Advances in packaging technologies for consumer-grade devices are no exception. While the most sophisticated packaging technologies for the consumer market – through silicon via interconnects and three-dimensional die stacking – deliver on their performance and space savings promises, this new technology is not a plug-and-play option for the defense community.
Should goods from commercial display suppliers be given favor over the technological advantages gained through expert innovation for the aerospace and defense industry simply due to low cost?
Microwave Journal: Optimize the IF from mission to mission
Many of our embedded sensor processing solutions support built-in MOTS+ for extreme ruggedness and BuiltSECURE nation-state level systems security engineering.
Our rugged packaging and effective cooling technologies are OpenVPX-compliant, SOSA-aligned building blocks designed to reduce your processing subsystems pre-integration risk, cost and schedule.
This paper investigates both the large area display architecture with available options to solve redundancy, as well as, beam steering techniques to limit canopy reflections in bubble canopy cockpits.
The real-time processing of data requires fastest FPGA devices and multicore processors. These devices cannot provide peak performance without highly dense and high-speed DDR4 and DDR5 memory.
Military digital transformation enables platforms to shrink and become more capable and adaptable for mission autonomy.
This white paper describes AI and cognitive computing (CC) and introduces the underlying largely commercially developer IP that enables them.
Devon Yablonski -Principal Product Manager, Sensor Processing NVIDIA GTC - November, 2019
GaN-based power amplifiers are ideal choice when your program requires high power, at high frequencies and in a small space.
Uncompromised data center processing capability deployable anywhere Evolving compute-intensive AI, SIGINT, autonomous vehicle, Electronic Warfare (EW), radar and sensor fusion applications require...
Learn about the differences between a commercial grade SSD and military-grade (Mercury) solid state drive. SLC, MLC and TLC NAND Flash variant are all rugged, secure (encrypted AES 256), and designed
Introducing the technologies developed by Mercury Systems & Intel that enable the best commercial data center processing capabilities to migrate across smarter fog and edge layers.
At a high level, the vast majority of contemporary compute processing hardware may be divided into two domains: powerful data center processors and smaller, embedded devices.
Although we all love connectivity and the benefits it brings us, there is a downside. By now, we’ve all heard about cars that have been hacked. Wired magazine even has an entire section of their...
Microwave and digital open-architecture transceivers in 3U and 6U form factors plus high-performance rackmount converters up to 40HGz with a 2GHz IBW
Maximizing FPGA processing and channel density in SWaP-constrained EW applications through accurate thermal modeling
How the most innovative embedded cooling technologies compare.
An overview of Mercury’s broad RF, microwave and mixed-signal solutions including compact components and highly integrated, modular assemblies.