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Military-Grade Microelectronics Packaging for the 21st Century

Technology innovations for high-volume, consumer applications continue to evolve at an accelerating pace. While these innovations deliver extraordinary performance at incredibly low price points for end users, the enabling technologies must be carefully scrutinized for applicability in military application scenarios. Advances in packaging technologies for consumer-grade devices are no exception. While the most sophisticated packaging technologies for the consumer market – through silicon via interconnects and three-dimensional die stacking – deliver on their performance and space savings promises, this new technology is not a plug-and-play option for the defense community. 

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RF, Microwave and Mixed-Signal Solutions
RF, Microwave and Mixed-Signal Solutions

An overview of Mercury’s broad RF, microwave and mixed-signal solutions including compact components and hi...

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Beyond VMEbus: Bringing commercial concepts to the military market
Beyond VMEbus: Bringing commercial concepts to the military market

Learn about the history of VME and how Modular Open System Architecture (MOSA) compliant systems with robus...

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