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Military-Grade Microelectronics Packaging for the 21st Century

Technology innovations for high-volume, consumer applications continue to evolve at an accelerating pace. While these innovations deliver extraordinary performance at incredibly low price points for end users, the enabling technologies must be carefully scrutinized for applicability in military application scenarios. Advances in packaging technologies for consumer-grade devices are no exception. While the most sophisticated packaging technologies for the consumer market – through silicon via interconnects and three-dimensional die stacking – deliver on their performance and space savings promises, this new technology is not a plug-and-play option for the defense community. 

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The Military Digital Convergence - enables next-generation military platforms
The Military Digital Convergence - enables next-generation military platforms

Military digital transformation enables platforms to shrink and become more capable and adaptable for missi...

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Takeaways from the AOC International Symposium and Conference
Takeaways from the AOC International Symposium and Conference

From the proliferation of smart phones to the introduction of self-driving cars, the last decade has brough...

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