Erin Spring

  • High-Density DDR for the Tactical Edge Infographic

    High-Density DDR for the Tactical Edge Infographic

    Processing large volumes of data in rugged environments away from climate-controlled data centers requires compact and dependable memory solutions.

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  • Military-Grade High-Density DDR Memory Product Brief

    Military-Grade High-Density DDR Memory Product Brief

    Compact and rugged DDR memory components for SWaP-constrained applications

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  • On Demand: Accelerating Defense Microelectronics Through Our Digital Transformation

    On Demand: Accelerating Defense Microelectronics Through Our Digital Transformation

    In this webinar, we discuss four decades of innovative 2D and 2.5D microelectronics packaging and integration, then review the latest trends in microelectronics.

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  • On Demand: Overcoming Memory Design Challenges in High-Performance Edge Computing

    On Demand: Overcoming Memory Design Challenges in High-Performance Edge Computing

    In this webinar, discover how to address memory design challenges at the sensor edge with modern packaging techniques that help avoid system performance limitations and other development imperatives.

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  • Article:  Redefining Sensor Edge Processing

    Article: Redefining Sensor Edge Processing

    Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.

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  • A New Paradigm for Defense-Grade Advanced Microelectronics

    A New Paradigm for Defense-Grade Advanced Microelectronics

    The Department of Defense has shifted priorities as new threats emerge and the U.S. seeks to secure innovative solutions, placing advanced microelectronics at the forefront of its agenda.

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