For more than 30 years, Mercury Systems has delivered SWaP-optimized multi-chip modules (MCM) and System-in-Package (SiP) devices. Our advanced thermal and electrical modeling capabilities enable modern FPGA and processor adoption for today and tomorrow’s most advanced military applications. Our domain expertise in rugged 3D packaging eliminates SWaP versus performance compromises.
- Combine surface mount, flip chip, die attach and wire bond technologies on the same device
- SWaP + Ruggedization – ideal for missiles, munitions and hypersonics
- Material selection for high reliability - Gold bond wire and Lead (Pb) solder with wide ball pitch
- Certified to MIL-PRF-38534 Class H and Class K and MILPRF-38535 Class M
- Rapid development cycle from concept to prototype to volume production
- Advanced 3D packaging using TSV interconnects in development