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Military-Grade Microelectronics Packaging for the 21st Century

Technology innovations for high-volume, consumer applications continue to evolve at an accelerating pace. While these innovations deliver extraordinary performance at incredibly low price points for end users, the enabling technologies must be carefully scrutinized for applicability in military application scenarios. Advances in packaging technologies for consumer-grade devices are no exception. While the most sophisticated packaging technologies for the consumer market – through silicon via interconnects and three-dimensional die stacking – deliver on their performance and space savings promises, this new technology is not a plug-and-play option for the defense community. 

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Enabling edge processing with stacked, high-speed DDR4 and DDR5 memory
Enabling edge processing with stacked, high-speed DDR4 and DDR5 memory

The real-time processing of data requires fastest FPGA devices and multicore processors. These devices cann...

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OpenRFM - A Better Alternative For An Open Architecture to Support EW, EA and SIGINT Applications
OpenRFM - A Better Alternative For An Open Architecture to Support EW, EA and SIGINT Applications

This white paper explains why OpenRFM can change the game in building modular, interoperable and affordable...

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