Application Note: PBGA Thermal Resistance Correlation

The thermal resistance for plastic ball grid array (PBGA) multi-chip packages (MCP) published in datasheets are results from thermal modeling software calculations. This paper explains how the simulation results were correlated to actual measured values.

Previous Asset
White Paper:  Accurate FPGA Power Modeling
White Paper: Accurate FPGA Power Modeling

Maximizing FPGA processing and channel density in SWaP-constrained EW applications through accurate thermal...

Next Asset
Application Note:  Thermal Design Considerations (of Non-BGA products)
Application Note: Thermal Design Considerations (of Non-BGA products)

As system operating frequencies increase, electronic components must dissipate more power to accommodate th...