As system operating frequencies increase, electronic components must dissipate more power to accommodate the needed reduction in access time. Thermal considerations become increasingly important in designs as power consumption approaches the limits of the package power dissipation.
Welcome to fall! Just a few short hops from here to winter, and up here in the Northeast, we never know if the weather is going to be mild or wild. Either way, expect a lot of temperature...
Learn how Mercury builds products with varying degrees of enhanced durability to operature under extreme environmental conditions, including repeated temperature cycling over wide temperature ranges.
Mercury's rugged packaging and effective cooling technologies are OpenVPX-compliant, SOSA-aligned building blocks designed to reduce your processing subsystems pre-integration risk, cost and schedule.
Data center GPU coprocessing for aerospace and defense: High-performance computing has evolved into high-performance embedded edge computing.
How the most innovative embedded cooling technologies compare, Embedding modern, powerful processors into rugged OpenVPX processing systems requires efficient cooling for reliable, full throttle, unre
Maximizing FPGA processing and channel density in SWaP-constrained EW applications through accurate thermal modeling.
The thermal resistances for the Plastic Ball Grid Array (PBGA) Multi Chip Packages (MCP) published in WEDC data sheets are results from thermal modeling software calculations.