Application Note: Thermal Design Considerations (of Non-BGA products)

As system operating frequencies increase, electronic components must dissipate more power to accommodate the needed reduction in access time.  Thermal considerations become increasingly important in designs as power consumption approaches the limits of the package power dissipation.

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Application Note:  PBGA Thermal Resistance Correlation
Application Note: PBGA Thermal Resistance Correlation

The thermal resistances for the Plastic Ball Grid Array (PBGA) Multi Chip Packages (MCP) publ...

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