Product Brief: Military-Grade High-Density DDR Memory

March 24, 2021 Erin Spring

Rugged, high-density memory is a critical element in advanced edge processing. As these systems get smaller and their processing needs increase, memory modules must deliver high-performance in a small form factor. SWaP-optimized, compact BGA packages consisting of multiple stacked die save board space and improve reliability.

Our environmentally tested BGA packaged solutions are manufactured through a trusted supply chain in a DMEA- and AS9100-certified facility. Our relationships with semiconductor suppliers and the ability to redesign and provide form-fit-function (FFF) replacement help mitigate obsolescence risks.

Highlights

  • Advanced miniaturization technology resulting in up to 87% space savings
  • Compact plastic BGA package consisting of multiple stacked die
  • Military-grade performance with DMEA-trusted manufacturing and supply chain
  • Military, industrial and commercial temperature ranges
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