Rugged, high-density memory is a critical element in advanced edge processing. As these systems get smaller and their processing needs increase, memory modules must deliver high-performance in a small form factor. SWaP-optimized, compact BGA packages consisting of multiple stacked die save board space and improve reliability.
Our environmentally tested BGA packaged solutions are manufactured through a trusted supply chain in a DMEA- and AS9100-certified facility. Our relationships with semiconductor suppliers and the ability to redesign and provide form-fit-function (FFF) replacement help mitigate obsolescence risks.
- Advanced miniaturization technology resulting in up to 87% space savings
- Compact plastic BGA package consisting of multiple stacked die
- Military-grade performance with DMEA-trusted manufacturing and supply chain
- Military, industrial and commercial temperature ranges