Microwave Journal: Optimize the IF from mission to mission
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
In order to minimize cost and time-to-market, the hardware must be flexible and modular. To address this emerging-need, we have developed a multi-channel, coherent system architecture.
Data center GPU coprocessing for aerospace and defense: High-performance computing has evolved into high-performance embedded edge computing. The post Taking the Data Center to the Edge with...