Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
By utilizing the NVIDIA EGX edge AI platform for edge computing, coupled with open software stacks, machine...
Enabling innovative ways to apply scalable and standardized technology to the design, development and sustainment challenges
Rappid: A modular, application-ready spectrum processing platform
In this webinar, you will learn how Mercury Systems, NVIDIA and SigmaX are securing machine learning for multi-domain operations with agile edge servers and cloud-native open software stacks.
By utilizing the NVIDIA EGX edge AI platform for edge computing, coupled with open software stacks, machine learning (ML) data can be deployed and accelerated to retain operational advantage....
In order to minimize cost and time-to-market, the hardware must be flexible and modular. To address this emerging-need, we have developed a multi-channel, coherent system architecture.
Data center GPU coprocessing for aerospace and defense: High-performance computing has evolved into high-performance embedded edge computing. The post Taking the Data Center to the Edge with...
Microwave Journal: Optimize the IF from mission to mission