Agile IF Architectures Enable Flexible EW and ELINT Systems

March 31, 2020

Microwave Journal: Optimize the IF from mission to mission

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Redefining Sensor Edge Processing with 2.5D System-in-Package Technology
Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine ...

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EnsembleSeries OSA Product Guide for Sensor Processing
EnsembleSeries OSA Product Guide for Sensor Processing

Many of our embedded sensor processing solutions support built-in MOTS+ for extreme ruggedness and BuiltSEC...