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White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

June 24, 2020

Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power.  By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.  Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.

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White Paper:  Xeon-D Vs Xeon-E for Embedded Radar Applications
White Paper: Xeon-D Vs Xeon-E for Embedded Radar Applications

Comparing Intel Xeon server-class processors for Space Time Adaptive Processing (STAP) applications.

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Contributed Article: Agile IF Architectures Enable Flexible EW and ELINT Systems
Contributed Article: Agile IF Architectures Enable Flexible EW and ELINT Systems

Microwave Journal: Optimize the IF from mission to mission