Enabling Edge Processing with Stacked, High-Speed DDR4 and DDR5 Memory

In military environments, seconds can be the difference between mission success or failure and life or death. System malfunction or failure due to poor signal integrity within integrated circuits and embedded board designs leads to catastrophic events. 

The problems are stacking up

The complexity of die stacking and wire bonding increases with each additional die needed to design high-density memory, such as a single 16GB DDR4 device or a custom multi-chip module (MCM) device. With so many circuits in a tightly stacked configuration, signal integrity is at the forefront of design considerations. 

Previous Asset
Rugged Server Product Guide
Rugged Server Product Guide

Our servers are designed from the ground up for C4I and other mission-critical applications where performan...

Next Asset
Making 5G Secure and Reliable
Making 5G Secure and Reliable

For the modern battlefield with hypersonic weapons, “real-time” answers enabled by 5G are critical. Learn t...

×

Let's Talk. Contact Sales

First Name
Last Name
Company
Country
State
Phone Number
Product Category
Product Title or Part Number
Comments or Inquiry
Thank you!
Error - something went wrong!