AI processing capability remote from the data center is required for smarter and more autonomous aerospace and defense missions. See how Mercury Systems and Intel are working together to make edge processing resilient enabling AI everywhere.
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White Paper: Processing Evolution for the Future Electronic Battlespace
Electronic battlefield complexity is a growing challenge. New, more sophisticated RF processing capabilities must be rapidly developed and deployed to operate successfully in contested environments.
Vodcast: Mercury Microelectronics SHIPs Out with RF SiPs
Tom Smelker, VP & GM of Mercury Microelectronics, discusses the company's new RFS1140 RF system-in-package as well as its broader involvement with the U.S. Navy's SHIP project.
Executive Interview: Roger Wells
Executive Interview with Roger Wells, EVP and President, Mercury Microelectronics, by Gary Lerude, Microwave Journal
Podcast: DefAero Technology Report with Mercury Systems’ Dr. Bill Conley
Podcast interview with Dr. Bill Conley, CTO at Mercury Systems, and Vago Muradian, Editor, Defense & Aerospace Report's Technology Report
2:00Mercury Systems Presents: Mission Success
Mercury’s cutting-edge avionics and mission-critical solutions make airspace the safest space to ensure flight and mission success. Open, safe and secure, our solutions enhance awareness and accuracy.
Infographic: Embedded Processing Subsystems
Mercury subsystems solve big data processing problems for platforms operating at the tactical edge. Our system design and integration experts deliver solutions that meet all your application needs
Case Study: NASA manufactures ZBLAN optical fibers in space
Learn more on Mercury and NASA manufacturing high-performance ZBLAN optical fibers in space aboard the International Space Station (ISS).
Assurance of DAL flight-safety certification and systems security engineering (SSE) is required to protect systems and mitigate risk for future smart and autonomous platforms
Podcast: Building strategic relationships to make commercial technology profoundly more accessible
Technology advances don’t happen overnight or in a bubble. That's why Mercury teams with the most innovative companies in the world, bringing the latest technologies to our customers.
Ready for take-off? Let’s set your electronics to airplane mode.
Most of us have heard an aircraft safety demonstration – a short pitch that reminds us to fasten seatbelts, locate emergency exits and set personal electronic devices to airplane mode....
Podcast: Deep dive on Pentek acquisition by Mercury Systems and Radar/EW Market Trends
Military Embedded Systems Deep Dive Podcast: Mercury Systems' FPGA single-board computers, data-acquisition boards, recording systems, and other products for radar, signals intelligence (SIGINT)
25:32Video: DAL Certifiable Computing for Future Avionics
Mercury partners with #Intel to deliver #DALcertifiable computing for future #avionics. Watch and listen as Mercury’s Greg Tiedemann and Intel’s Yemaya Bordain join MercuryNow to discuss their longsta
Tech Brief: Microelectronics for the Sensor Edge
We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.
1:19Video: Learn about Mercury's industry leading capabilities in 2.5D SiP microelectronics
Bringing trust and supply chain security to the latest commercial semiconductor solutions requires innovation at chip scale. High density 2.5D system-in-package technology solves industry challenges.
White Paper: Safety Certifiable Computing for Tomorrow's Avionics
Modern sensors and AI need powerful flight-ready computing, but creating safe multi-core processing systems is difficult to achieve. Learn why Intel-based solutions are suited for AI and FVL.
White Paper: Protecting Satellite Image Integrity from Radiation
Today's space imaging systems require radiation-tolerant NAND flash components with advanced error correction, packaged in lightweight, rugged VPX form factors.
Webinar: Accelerating Defense Microelectronics Through Our Digital Transformation
In this webinar, we discuss four decades of innovative 2D and 2.5D microelectronics packaging and integration, then review the latest trends in microelectronics.
Webinar: Open Architectures & Enduring Competitiveness
Closing this gap through investments in open systems, critical high-tech partnerships and open innovations, and building a collaborative culture in the spirit of how high-tech companies operate.
Webinar: Overcoming Memory Design Challenges in High-Performance Edge Computing
In this webinar, discover how to address memory design challenges at the sensor edge with modern packaging techniques that help avoid system performance limitations and other development imperatives.