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Military-Grade Microelectronics Packaging for the 21st Century

Technology innovations for high-volume, consumer applications continue to evolve at an accelerating pace. While these innovations deliver extraordinary performance at incredibly low price points for end users, the enabling technologies must be carefully scrutinized for applicability in military application scenarios. Advances in packaging technologies for consumer-grade devices are no exception. While the most sophisticated packaging technologies for the consumer market – through silicon via interconnects and three-dimensional die stacking – deliver on their performance and space savings promises, this new technology is not a plug-and-play option for the defense community. 

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Space-Qualified Microelectronics
Space-Qualified Microelectronics

Whether you application demands space-level reliability for RF components or storage devices, we have the d...

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Next-Generation Defense Electronics Manufacturing - AMC
Next-Generation Defense Electronics Manufacturing - AMC

This white paper answers a national defense imperative, "How do we put technology into the hands of our sol...