Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
This paper first discusses advanced capabilities that enhance LCD technology and then reviews business fact...
Mercury's Drogue Tracking System (DTS) provides a solution for U.S. Navy pilots for safer and simpler refueling.
The U.S. Air Force received new solutions for platforms like the F-16 fighter that require modernized communication management frameworks that can handle upcoming expanded SATCOM capabilities.
This webinar talks about the advantages of direct RF compared with traditional superheterodyne systems, where it is today and its technology roadmap, and its possibilities for the embedded industry.
Emerging FPGA architectures combine advanced RF converters and high-performance processing engines in a single package. Learn how to apply these devices to increase the effectiveness of EW systems.
AMD and Mercury are working together to deliver up to 20× more processing power closer to the edge. Join our webinar, moderated by John McHale from Military Embedded Systems, read abstract-
Learn how commercial technology companies and the aerospace and defense industry are merging their innovations to help government organizations enable on-orbit sensor fusion.
This article discusses a new generation of “Direct RF” data converters, revolutionizing system architectures across a wide class of platform applications and radio bands.
This white paper describes next generation direct RF to redefine what’s possible in radar and software radio, from jamming to electronic intelligence to significant bandwidth performance.
Image processing technology allows military aircraft to operate in past prohibited areas. Multi-sensor systems allow aircraft to operate in smoke, fog, snow, and heavy rain environments.
Designing post-quantum cryptography (PQC) is much more than just implementing an algorithm. You need industry-leading solutions that address all aspects of advanced cryptographic development. Read...
Direct RF technology disrupts traditional acquisition techniques, delivering huge speed and processing advancements. Learn how direct RF affects the world of EW, radar and signal intelligence.
For the first time in the market, there is an affordable, scalable ruggedized all-flash network-attached data storage solution purpose-built for challenging mission-critical applications.
Mercury's Rodger Hosking joins David Tremper, Director, Acquisition Integration and Interoperability, Office of the Undersecretary of Defense (OUSD) and industry experts for the MOSA virtual summit.
PCIe 5.0 protocol benefits a new generation of rugged, deployable application platforms with doubled bandwidth and is an integral part of the latest devices from industry giants, Intel and NVIDIA.
Tom Smelker, VP and GM of Mercury Microsystems, talks with 3DIncites on The Importance of Building Trusted and Secure Microelectronics.
SBIR-to-transition successes include the Joint Avionics Reconfigurable Virtual Information System (JARVIS) mission computer and the Digital Data Set (DDS) Systems for the Navy's T-45, read more-
Mercury partners with #Intel to deliver #DALcertifiable computing for future #avionics. Watch and listen as Mercury’s Greg Tiedemann and Intel’s Yemaya Bordain join MercuryNow to discuss their longsta
Modern sensors and AI need powerful flight-ready computing, but creating safe multi-core processing systems is difficult to achieve. Learn why Intel-based solutions are suited for AI and FVL.
Bringing trust and supply chain security to the latest commercial semiconductor solutions requires innovation at chip scale. High density 2.5D system-in-package technology solves industry challenges.