×

Please register to view this content

First Name
Last Name
Company
Job Title
Country
State
Opt me in to receive communications from Mercury Systems
Thank you
Error - something went wrong!
   

White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

June 24, 2020

Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power.  By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.  Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.

Previous Asset
Article:  The Big Data Battlefield
Article: The Big Data Battlefield

Learn what big data is and why the military relies on big data data pipelines to drive artificial intellige...

Next Asset
Article:  Making 5G Secure and Reliable
Article: Making 5G Secure and Reliable

For the modern battlefield with hypersonic weapons, “real-time” answers enabled by 5G are critical. Learn t...

×

Interested in our technology? Contact Sales

First Name
Last Name
Company
Country
State
Phone Number
Comments or Inquiry
Thank you, we will get back to you soon!
Error - something went wrong!