Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
Learn what big data is and why the military relies on big data data pipelines to drive artificial intellige...
Electronic battlefield complexity is a growing challenge. New, more sophisticated RF processing capabilities must be rapidly developed and deployed to operate successfully in contested environments.
Tom Smelker, VP & GM of Mercury Microelectronics, discusses the company's new RFS1140 RF system-in-package as well as its broader involvement with the U.S. Navy's SHIP project.
Executive Interview with Roger Wells, EVP and President, Mercury Microelectronics, by Gary Lerude, Microwave Journal
Podcast interview with Dr. Bill Conley, CTO at Mercury Systems, and Vago Muradian, Editor, Defense & Aerospace Report's Technology Report
Mercury’s cutting-edge avionics and mission-critical solutions make airspace the safest space to ensure flight and mission success. Open, safe and secure, our solutions enhance awareness and accuracy.
Mercury subsystems solve big data processing problems for platforms operating at the tactical edge. Our system design and integration experts deliver solutions that meet all your application needs
Learn more on Mercury and NASA manufacturing high-performance ZBLAN optical fibers in space aboard the International Space Station (ISS).
Assurance of DAL flight-safety certification and systems security engineering (SSE) is required to protect systems and mitigate risk for future smart and autonomous platforms
Technology advances don’t happen overnight or in a bubble. That's why Mercury teams with the most innovative companies in the world, bringing the latest technologies to our customers.
Most of us have heard an aircraft safety demonstration – a short pitch that reminds us to fasten seatbelts, locate emergency exits and set personal electronic devices to airplane mode....
Military Embedded Systems Deep Dive Podcast: Mercury Systems' FPGA single-board computers, data-acquisition boards, recording systems, and other products for radar, signals intelligence (SIGINT)
Mercury partners with #Intel to deliver #DALcertifiable computing for future #avionics. Watch and listen as Mercury’s Greg Tiedemann and Intel’s Yemaya Bordain join MercuryNow to discuss their longsta
We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.
Bringing trust and supply chain security to the latest commercial semiconductor solutions requires innovation at chip scale. High density 2.5D system-in-package technology solves industry challenges.
Modern sensors and AI need powerful flight-ready computing, but creating safe multi-core processing systems is difficult to achieve. Learn why Intel-based solutions are suited for AI and FVL.
Today's space imaging systems require radiation-tolerant NAND flash components with advanced error correction, packaged in lightweight, rugged VPX form factors.
In this webinar, we discuss four decades of innovative 2D and 2.5D microelectronics packaging and integration, then review the latest trends in microelectronics.
Closing this gap through investments in open systems, critical high-tech partnerships and open innovations, and building a collaborative culture in the spirit of how high-tech companies operate.
In this webinar, discover how to address memory design challenges at the sensor edge with modern packaging techniques that help avoid system performance limitations and other development imperatives.