The defense electronics market encompasses a significant range of environments — touching every corner of the globe and the atmosphere’s edge — from fixed installations with conditioned air environments, to mobile deployment in extreme temperature environments. Learn how Mercury uses varied manufacturing and design approaches to build products with multiple degrees of enhanced durability to operate under extreme environmental conditions, including repeated temperature cycling over wide temperature ranges. Requirements and best practices have been accumulated over dozens of military and avionics programs, resulting in a best-in-class set of design rules and manufacturing process called modified off-the-shelf (MOTS).
Take advantage of GPU data processing and AI/ML capabilities at the tactical edge by managing the challenges of extreme environment operation, SWaP-constrained platforms, and mitigating security risks
Using technologies like high-bandwidth memory, high-bit-rate optical interfaces and gigabit serial protocols to address processing and memory demands in modern military systems
Learn more on Mercury and NASA manufacturing high-performance ZBLAN optical fibers in space aboard the International Space Station (ISS).
Assurance of DAL flight-safety certification and systems security engineering (SSE) is required to protect systems and mitigate risk for future smart and autonomous platforms
Learn how Mercury and Intel collaborate to scale and deploy composable data center capabilities across the fog and edge layers with high performance embedded computing (HPEC)
Technology advances don’t happen overnight or in a bubble. That's why Mercury teams with the most innovative companies in the world, bringing the latest technologies to our customers.
Military Embedded Systems Deep Dive Podcast: Mercury Systems' FPGA single-board computers, data-acquisition boards, recording systems, and other products for radar, signals intelligence (SIGINT)
Modern sensors and AI need powerful flight-ready computing, but creating safe multi-core processing systems is difficult to achieve. Learn why Intel-based solutions are suited for AI and FVL.
Bringing trust and supply chain security to the latest commercial semiconductor solutions requires innovation at chip scale. High density 2.5D system-in-package technology solves industry challenges.
Most of us have heard an aircraft safety demonstration – a short pitch that reminds us to fasten seatbelts, locate emergency exits and set personal electronic devices to airplane mode....
We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.
Mercury partners with #Intel to deliver #DALcertifiable computing for future #avionics. Watch and listen as Mercury’s Greg Tiedemann and Intel’s Yemaya Bordain join MercuryNow to discuss their longsta
Today's space imaging systems require radiation-tolerant NAND flash components with advanced error correction, packaged in lightweight, rugged VPX form factors.
JPL required a reliable, rad-tolerant storage device with large storage capacity. Mercury delivered the RH3440 SSDR, enabling high-performance on-orbit sensor data processing and storage.
In this webinar, we discuss four decades of innovative 2D and 2.5D microelectronics packaging and integration, then review the latest trends in microelectronics.
In this webinar, discover how to address memory design challenges at the sensor edge with modern packaging techniques that help avoid system performance limitations and other development imperatives.
Closing this gap through investments in open systems, critical high-tech partnerships and open innovations, and building a collaborative culture in the spirit of how high-tech companies operate.
Welcome to fall! Just a few short hops from here to winter, and up here in the Northeast, we never know if the weather is going to be mild or wild. Either way, expect a lot of temperature...