We all know of large, precision-guided weapons. Weighing in at about 3,000 pounds and with a unit price over $1M, the latest generation cruise missiles can be launched from the safety of a ship and travel over 1,000 miles with the necessary precision to minimize collateral damage. These missiles include advanced electronics such as datalinks, radar altimeters, inertial guidance, and digital processing. While they represent the culmination of decades long technology development, an emerging need for smaller precision-guided munitions is forcing the defense electronics industry to find novel ways of building extremely compact, but also modular, systems. Developing a precision-guided capability small enough to fit into a munition that weighs less than 0.1% of a cruise missile, all for a fraction of the cost, requires a new approach built from the ground up.
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facili...
Mercury Systems has pioneered a next generation defense electronics business model and supporting manufacturing infrastructure that addresses globalized supply chains.
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.
At a high level, the vast majority of contemporary compute processing hardware may be divided into two domains: powerful data center processors and smaller, embedded devices. Embedded devices have...