Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)

April 9, 2020

At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology.  TSVs facilitate the vertical integration of multiple die.  As the demand for TSVs increases across the application spectrum, so does the need for a comprehensive understanding of their electrical behavior over a broad frequency spectrum.

Previous Asset
Next-Generation Defense Electronics Manufacturing - AMC
Next-Generation Defense Electronics Manufacturing - AMC

Mercury Systems has pioneered a next generation defense electronics business model and supporting manufactu...

Next Asset
A Novel RF and Digital Microelectronics Architecture for Precision Guided Weapons
A Novel RF and Digital Microelectronics Architecture for Precision Guided Weapons

Developing a precision-guided capability small enough to fit into a munition that weighs less than 0.1% of ...