Memory
Learn how advanced memory from Mercury solves some of the hardest SWaP and reliability challenges in unpredictable and extreme environments.
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Listen to PodcastDelivering high-quality and highly reliable memory products through industry partnerships
High-quality, high-reliability and ruggedness are key for A&D industry applications. Hear how Mercury and Micron partner to deliver trusted memory modules across extreme environments.
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Watch WebinarWebinar: Overcoming Memory Design Challenges in High-Performance Edge Computing
In this webinar, discover how to address memory design challenges at the sensor edge with modern packaging techniques that help avoid system performance limitations and other development imperatives.
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Infographic: High-Density DDR for the Tactical Edge
Processing large volumes of data in rugged environments away from climate-controlled data centers requires compact and dependable memory solutions.
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Product Brief: Military-Grade High-Density DDR Memory
Compact and rugged DDR memory components for SWaP-constrained applications
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Tech Brief: Microelectronics for the Sensor Edge
We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.
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Product Guide: Microelectronics Memory Quick Reference
Explore our portfolio of rugged, high-density DDR, SSRAM and NOR Flash memory products with our quick reference guide detailing the size, organization, data rate and more.
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Read NowArticle: Redefining Sensor Edge Processing
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.
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Tech Brief: High Density Secure Memory
This technical brief examines Mercury's portfolio of High Density Secure Memory products, a unique offering delivering high-speed, military-hardened memory solutions in small form factors.
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Application Note: PBGA Thermal Resistance Correlation
The thermal resistances for the Plastic Ball Grid Array (PBGA) Multi Chip Packages (MCP) published in WEDC data sheets are results from thermal modeling software calculations.
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White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
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White Paper: Enabling Edge Processing with Stacked, High-Speed DDR4 and DDR5 Memory
The real-time processing of data requires fastest FPGA devices and multicore processors. These devices cannot provide peak performance without highly dense and high-speed DDR4 and DDR5 memory.
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White Paper: Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.
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Article: Stacked, high-speed DDR4 and DDR5 memory
To handle extreme workload, system architects must design boards using the fastest FPGA devices & Intel multicore processors. These devices cannot provide peak performance with high-speed DDR4 memory.
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Product Guide: Space-Qualified Microelectronics
Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.
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Read ArticleAssured Signal Integrity in stacked, high-speed DDR4 and DDR5 memory
Edge processing architectures in today’s autonomous and AI military systems, process an ever growing amount of sensor data. Many of these systems or devices used for edge processing applications...
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Read ArticleDon’t believe what they say… Size DOES matter!
Don’t believe what they say…Size DOES Matter! In this case the smaller the better – especially in the constrained spaces of an aircraft cockpit or an unmanned vehicle where every inch is precious...
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