Memory

Processing large volumes of data in rugged environments away from climate-controlled data centers requires compact and dependable memory solutions.

Compact and rugged DDR memory components for SWaP-constrained applications

We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.

Explore our portfolio of rugged, high-density DDR, SSRAM and NOR Flash memory products with our quick reference guide detailing the size, organization, data rate and more.

Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.

This technical brief examines Mercury's portfolio of High Density Secure Memory products, a unique offering delivering high-speed, military-hardened memory solutions in small form factors.

By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.

The real-time processing of data requires fastest FPGA devices and multicore processors. These devices cannot provide peak performance without highly dense and high-speed DDR4 and DDR5 memory.

At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.

To handle extreme workload, system architects must design boards using the fastest FPGA devices & Intel multicore processors. These devices cannot provide peak performance with high-speed DDR4 memory.

Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.