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Enabling edge processing with stacked, high-speed DDR4 and DDR5 memory

In military environments, seconds can be the difference between mission success or failure and life or death. System malfunction or failure due to poor signal integrity within integrated circuits and embedded board designs leads to catastrophic events. 

The problems are stacking up

The complexity of die stacking and wire bonding increases with each additional die needed to design high-density memory, such as a single 16GB DDR4 device or a custom multi-chip module (MCM) device. With so many circuits in a tightly stacked configuration, signal integrity is at the forefront of design considerations. 

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High Density Secure Memory Tech Brief
High Density Secure Memory Tech Brief

This technical brief examines Mercury's portfolio of High Density Secure Memory products, a unique offering...

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Space-Qualified Microelectronics
Space-Qualified Microelectronics

Whether you application demands space-level reliability for RF components or storage devices, we have the d...