Check out this tour of our microelectronics packaging facility and learn how Mercury is able to maximize circuit density through die staking.
Edge processing architectures in today’s autonomous and AI military systems, process an ever growing amount...
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.
The real-time processing of data requires fastest FPGA devices and multicore processors. These devices cannot provide peak performance without highly dense and high-speed DDR4 and DDR5 memory.
We discuss our proposal for a new microelectronics packaging platform addressing the practical needs of the defense market for the 21st century.
To handle extreme workload, system architects must design boards using the fastest FPGA devices & Intel multicore processors. These devices cannot provide peak performance with high-speed DDR4 memory.
Our domain expertise in rugged 3D packaging eliminates SWaP versus performance compromises. For more than 30 years, we have delivered SWaP-optimized multi-chip modules and System-in-Package devices.
The thermal resistances for the Plastic Ball Grid Array (PBGA) Multi Chip Packages (MCP) published in WEDC data sheets are results from thermal modeling software calculations.
Edge processing architectures in today’s autonomous and AI military systems, process an ever growing amount of sensor data. Many of these systems or devices used for edge processing applications...
Don’t believe what they say…Size DOES Matter! In this case the smaller the better – especially in the constrained spaces of an aircraft cockpit or an unmanned vehicle where every inch is precious...
Mercury Systems specializes in three-dimensional packaging of commercial memory technologies to produce military-grade, high reliability high density secure memory solutions. Designed and manufacture