×

Register now for complete access to all Resource Hub content!

First Name
Last Name
Company
Job Title
Country
State
Opt me in to receive communications from Mercury Systems
Thank you!
Error - something went wrong!
   

Military-Grade Microelectronics Packaging for the 21st Century

Technology innovations for high-volume, consumer applications continue to evolve at an accelerating pace. While these innovations deliver extraordinary performance at incredibly low price points for end users, the enabling technologies must be carefully scrutinized for applicability in military application scenarios. Advances in packaging technologies for consumer-grade devices are no exception. While the most sophisticated packaging technologies for the consumer market – through silicon via interconnects and three-dimensional die stacking – deliver on their performance and space savings promises, this new technology is not a plug-and-play option for the defense community. 

Previous Asset
Enabling edge processing with stacked, high-speed DDR4 and DDR5 memory
Enabling edge processing with stacked, high-speed DDR4 and DDR5 memory

The real-time processing of data requires fastest FPGA devices and multicore processors. These devices cann...

Next Asset
Microelectronics Products Quick Reference Guide
Microelectronics Products Quick Reference Guide