×

Register now for complete access to all Resource Hub content!

First Name
Last Name
Company
Job Title
Country
State
Opt me in to receive communications from Mercury Systems
Thank you!
Error - something went wrong!
   

PBGA Thermal Resistance Correlation

The thermal resistance for plastic ball grid array (PBGA) multi-chip packages (MCP) published in WEDC dat

Previous Asset
Stacked, high-speed DDR4 and DDR5 memory
Stacked, high-speed DDR4 and DDR5 memory

To handle extreme workload, system architects must design boards using the fastest FPGA devices & Intel mul...

Next Asset
Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)
Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)

At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facili...