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PBGA Thermal Resistance Correlation

The thermal resistance for plastic ball grid array (PBGA) multi-chip packages (MCP) published in WEDC dat

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Military-Grade Custom Microelectronics
Military-Grade Custom Microelectronics

Our domain expertise in rugged 3D packaging eliminates SWaP versus performance compromises. For more than 3...

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Assured Signal Integrity in stacked, high-speed DDR4 and DDR5 memory
Assured Signal Integrity in stacked, high-speed DDR4 and DDR5 memory

Edge processing architectures in today’s autonomous and AI military systems, process an ever growing amount...