Article: Redefining Sensor Edge Processing

February 24, 2021 Erin Spring

Heterogeneous 2.5D system-in-package (SiP) technology, a new trend in microelectronics that includes multiple die inside the same package, is proving to be an excellent match for sensor-edge processing requirements, as it integrates high-performance chiplets to support direct digitization of wideband RF signals.

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Product Guide:  Microelectronics Memory Quick Reference
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Explore our portfolio of rugged, high-density DDR, SSRAM and NOR Flash memory products with our quick refer...

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Tech Brief:  High Density Secure Memory
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This technical brief examines Mercury's portfolio of High Density Secure Memory products, a unique offering...