Article: Stacked, high-speed DDR4 and DDR5 memory

Today’s autonomous and artificial intelligence (AI) military systems process an ever-growing amount of sensor data. To handle this extreme workload, system architects must design boards using the fastest FPGA [field-programmable gate array] devices and Intel multicore processors. These devices cannot provide peak performance without massive amounts of high-speed double-data rate fourth generation (DDR4) memory for resident data and real-time execution

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White Paper:  Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)
White Paper: Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)

At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facili...

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Product Guide: Space-Qualified Microelectronics
Product Guide: Space-Qualified Microelectronics

Whether you application demands space-level reliability for RF components or storage devices, we have the d...