Mercury Systems has pioneered a next generation defense electronics business model and supporting manufacturing infrastructure that addresses globalized supply chains...
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At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.
A New Paradigm for Defense-Grade Advanced Microelectronics
The Department of Defense has shifted priorities as new threats emerge and the U.S. seeks to secure innovative solutions, placing advanced microelectronics at the forefront of its agenda.
Enabling a Trusted Domestic Microelectronics Ecosystem
Mercury Systems is a next-generation defense electronics company making commercial technologies profoundly more accessible to aerospace and defense. Watch the interactive virtual conversation with...
Article: Redefining Sensor Edge Processing
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.
A Trusted and Secure Ecosystem for Microelectronics
As the Pentagon continues to make microelectronics modernization a number-one priority in light of COVID-19, Mercury Systems CEO Mark Aslett shares his thoughts about the importance of addressing...
Leading the Way With Edge Processing
As technology scales, traditional AI processing in facilities away from the battlefield is no longer a solution. Mercury Systems is using new 2.5D SiP technology to enable edge processing...
Developing a precision-guided capability small enough to fit into a munition that weighs less than 0.1% of a cruise missile, all for a fraction of the cost.