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Military-Grade Microelectronics Packaging for the 21st Century

Technology innovations for high-volume, consumer applications continue to evolve at an accelerating pace. While these innovations deliver extraordinary performance at incredibly low price points for end users, the enabling technologies must be carefully scrutinized for applicability in military application scenarios. Advances in packaging technologies for consumer-grade devices are no exception. While the most sophisticated packaging technologies for the consumer market – through silicon via interconnects and three-dimensional die stacking – deliver on their performance and space savings promises, this new technology is not a plug-and-play option for the defense community. 

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EnsembleSeries Open System Architecture Embedded Processing Building Blocks
EnsembleSeries Open System Architecture Embedded Processing Building Blocks

We champion open systems architectures that support our customers' need for affordability and interoperabil...

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Mercury Systems acquires Geco Incorporated
Mercury Systems acquires Geco Incorporated

Mercury acquires Geco’s integration, test and software capabilities to produce mission-critical aerospace p...

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