OpenFPGA: Rappid firmware app-based electronic warfare
Rappid: A modular, application-ready spectrum processing platform
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
A comprehensive look at how a Next Generation Business Model can be purpose-built to meet the challenges we and our allies face.
Our approach to building products for enhanced durability under extreme environmental conditions, including repeated temperature cycling over wide temperature ranges.