Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
A comprehensive look at how a Next Generation Business Model can be purpose-built to meet the challenges we and our allies face.
Our approach to building products for enhanced durability under extreme environmental conditions, including repeated temperature cycling over wide temperature ranges.