Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
Recommended
Tech Brief: OpenFPGA, Rappid firmware app-based electronic warfare
Enabling innovative ways to apply scalable and standardized technology to the design, development and sustainment challenges
White Paper: Rappid; an app-ready, spectrum processing platform
Rappid: A modular, application-ready spectrum processing platform
Our approach to building products for enhanced durability under extreme environmental conditions, including repeated temperature cycling over wide temperature ranges.