The artificial intelligence (AI) revolution is profoundly influencing all manners of human endeavor and has the potential to shift the global balance of power. It is therefore a priority to develop...
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Enabling Big Data Processing and AI-Powered Everything, Everywhere
Learn how Mercury and Intel collaborate to scale and deploy composable data center capabilities across the fog and edge layers with high performance embedded edge computing (HPEEC)
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White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
Commercial digital convergence has created converged media, information systems, smartphones and autonomous vehicles. Digital convergence now has a proven roadmap behind it and is enabling...
Taking the Data Center to the Edge with High-Performance Embedded Edge Computing
Data center GPU coprocessing for aerospace and defense: High-performance computing has evolved into high-performance embedded edge computing. The post Taking the Data Center to the Edge with...
Selecting Optimal Avionic and Vetronic Displays for Your Application
This paper first discusses advanced capabilities that enhance LCD technology and then reviews business factors to consider when selecting or specifying display systems.
Modular Open Systems Approach for Weapons Systems is a Warfighting Imperative
The recent tri-service memorandum requiring modular open system approaches to be deployed in all future defense systems is aimed at putting the best technology into the hands of the warfighter faster.
Rugged Embedded Packaging and Next-Generation Cooling
Our rugged packaging and effective cooling technologies are OpenVPX-compliant, SOSA-aligned building blocks designed to reduce your processing subsystems pre-integration risk, cost and schedule.