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The Open Group Sensor Open System Architecture, known as the SOSA™ Technical Standard, applies a modular open systems approach (MOSA) to high-performance defense sensor systems such as radar, electron

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An overview of Mercury’s broad RF, microwave and mixed-signal solutions including compact components and highly integrated, modular assemblies.
From the proliferation of smart phones to the introduction of self-driving cars, the last decade has brought sweeping technological advances across all industries.
In order to minimize cost and time-to-market, the hardware must be flexible and modular. To address this emerging-need, we have developed a multi-channel, coherent system architecture.
Microwave Journal: Optimize the IF from mission to mission
We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.

Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.