SWaP-optimized and ruggedized for operation in harsh environments, learn how Mercury ’s ACAP-based solutions will bring new levels of application capability to the tactical edge.
Discover the perfect platform for integrating Mercury's RFSoC-based Quartz products with other third-party ...
Use the latest technology that allow real-time recording systems to keep up with the ever-increasing speed requirements of wide-bandwidth data capture in modern military systems.
You can’t open an industry magazine or visit a website without seeing news about SOSA, open standards and their adoption. Read more about SOSA - its origins, benefits and what's next.
Using technologies like high-bandwidth memory, high-bit-rate optical interfaces and gigabit serial protocols to address processing and memory demands in modern military systems
Discover the perfect platform for integrating Mercury's RFSoC-based Quartz products with other third-party content, such chassis and backplane, 40 GbE switch, SBC and chassis manager.
Learn about ACAP technology and how it's contributing to faster, stronger and more capable systems at the tactical edge.
The Open Group Sensor Open System Architecture, known as the SOSA™ Technical Standard, applies a modular open systems approach (MOSA) to high-performance defense sensor systems such as radar, electron
Military Embedded Systems Deep Dive Podcast: Mercury Systems' FPGA single-board computers, data-acquisition boards, recording systems, and other products for radar, signals intelligence (SIGINT)
It’s finally here. Trusted, onshore 2.5D custom microelectronics. Listen as Tom Smelker, VP and general manager, Microsystems, discusses Mercury’s collaboration with semiconductor partners to...
An overview of Mercury’s broad RF, microwave and mixed-signal solutions including compact components and highly integrated, modular assemblies.
From the proliferation of smart phones to the introduction of self-driving cars, the last decade has brought sweeping technological advances across all industries.
In order to minimize cost and time-to-market, the hardware must be flexible and modular. To address this emerging-need, we have developed a multi-channel, coherent system architecture.
Microwave Journal: Optimize the IF from mission to mission
We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
SOSA can provide the balance between plug-and-play and secure sustainability for multiple devices to work together seamlessly. This new technology architecture can save time, reduce SWaP, and...
Developing a precision-guided capability small enough to fit into a munition that weighs less than 0.1% of a cruise missile, all for a fraction of the cost.
GaN-based power amplifiers are ideal choice when your program requires high power, at high frequencies and in a small space.
Maximizing FPGA processing and channel density in SWaP-constrained EW applications through accurate thermal modeling.