Tech Brief: Microelectronics for the Sensor Edge

May 14, 2021 Erin Spring

Starting at chip scale with a trusted portfolio of microelectronic packaging capabilities is essential for advanced edge computing.  Whether processing high volumes of radar data in the nose of a fighter jet, powering the latest UAVs or safely operating self-driving cars, an increasing number of applications rely on processing technology at the sensor edge, far from the data center.

Delivering the latest technology to these challenging environments is a major undertaking. The hardware must utilize the same semiconductor technology that powers commercial data centers but in a compact and rugged form factor. Additionally, a trusted supply chain and proven processes are essential for mission-critical applications.

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Article:  Redefining Sensor Edge Processing
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Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge p...

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