Modified off-the-shelf plus (MOTS+) packaging for extreme environmental protection.
Recommended
Enabling Big Data Processing and AI-Powered Everything, Everywhere
Learn how Mercury and Intel collaborate to scale and deploy composable data center capabilities across the fog and edge layers with high performance embedded edge computing (HPEEC)
Modern Processing Approaches for JADC2
Listen to the latest MercuryNOW podcast as we discuss the challenges for JADC2 implementation and the role Mercury is playing to help make it a reality – from data center processing at the edge to...
2:13Mercury's rugged edge servers accelerate compute-heavy mission-critical applications like artificial intelligence (AI), signals intelligence (SIGINT), virtualization and big data analytics.
A New Paradigm for Defense-Grade Advanced Microelectronics
The Department of Defense has shifted priorities as new threats emerge and the U.S. seeks to secure innovative solutions, placing advanced microelectronics at the forefront of its agenda.
Next-Gen Safe and Secure Processing Systems for Aerospace and Defense
This whitepaper discusses how new holistic systems security engineering and flight-safety certification design approaches are enabling smarter platforms to be deployed anywhere.
How Mercury Systems and Intel Collaborate to Bring AI to Defense
Mercury and Intel collaborate, bringing their own unique sets of technological know-how, to develop and implement AI applications for quicker deployment and integration in the field to enhanc
1:01Sam Ceccola, HPE's DoD CTO, speaks about how Mercury Systems' RES-XR6 Alliance rugged, high-performance servers bring the performance of HPE's server platforms to the harshest military environments.
2:21Mercury's rugged edge servers accelerate Artificial Intelligence (AI), Cybersecurity, Signals Intelligence (SIGINT) and C4ISR tactical edge computing workloads.
There is a gap within the community for reliable providers of secure, scalable and affordable subsystems that can support critical programs. Learn how we fill this gap with our "built-in" security.
Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.
Learn what big data is and why the military relies on big data data pipelines to drive artificial intelligence and ensure mission success in the multi-domain battlefield.
Our CANGuard solution is a transparent CAN filtering technology that can efficiently differentiate messages a given device is authorized to transmit and receive from messages it is not.
Enabling a Trusted Domestic Microelectronics Ecosystem
Mercury Systems is a next-generation defense electronics company making commercial technologies profoundly more accessible to aerospace and defense. Watch the interactive virtual conversation with...
Sailing Through the Fog into the Edge
Learn about the trends, requirements, and limitations of Defense Fog and Edge Computing. Our blog post compares fog and edge processing layer resources in commercial and defense markets
Encryption Keys: The Cliff Notes Version, Part 3 – Key Management Modes
In the first two posts of this series, I reviewed fundamental terms and concepts of encryption key classifications and discussed roles of passwords versus keys and hash algorithms. In this post,...
Military-Grade Secure Solid State Drives Part 2: Encryption Decoded
In my introduction to military grade SSDs I conjured an image from a familiar movie of a data recorder destroyed by internal combustion to remove evidence of high value data. While the end result...
For the modern battlefield with hypersonic weapons, “real-time” answers enabled by 5G are critical. Learn the promises and pitfalls of 5G and how it can be made secure and reliable.
NAND flash, packaged as a Solid State Drives (SSD), are now a common component in defense equipment. Add security and SSDs become the ideal big-data secure storage solution for defense application.
Redefining Sensor Edge Processing with 2.5D System-in-Package Technology
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
Maximum protection, and full compliance with CSfC program guidelines, can only be achieved with proven diversity in the selection of security components.