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Military-Grade Microelectronics Packaging for the 21st Century

Technology innovations for high-volume, consumer applications continue to evolve at an accelerating pace. While these innovations deliver extraordinary performance at incredibly low price points for end users, the enabling technologies must be carefully scrutinized for applicability in military application scenarios. Advances in packaging technologies for consumer-grade devices are no exception. While the most sophisticated packaging technologies for the consumer market – through silicon via interconnects and three-dimensional die stacking – deliver on their performance and space savings promises, this new technology is not a plug-and-play option for the defense community. 

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Rugged Server Product Guide
Rugged Server Product Guide

Our servers are designed from the ground up for C4I and other mission-critical applications where performan...

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Servers for the Air Force
Servers for the Air Force

Our rugged servers are designed for Air Force applications where performance, interoperability, and availab...

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