Self-encrypting hardware, such as Mercury’s portfolio of secure solid-state drives (SSD), provide the ultimate data security. This tech brief explores Mercury’s “five S’s” of secure data storage for military embedded systems: SWaP (size, weight, and power), Speed, Security, Sanitize and Self-Destruct.
This white paper describes AI and cognitive computing (CC) and introduces the underlying largely commercial...
Learn more on Mercury and NASA manufacturing high-performance ZBLAN optical fibers in space aboard the International Space Station (ISS).
Today's space imaging systems require radiation-tolerant NAND flash components with advanced error correction, packaged in lightweight, rugged VPX form factors.
JPL required a reliable, rad-tolerant storage device with large storage capacity. Mercury delivered the RH3440 SSDR, enabling high-performance on-orbit sensor data processing and storage.
NASA's Jet Propulsion Laboratory selects Mercury technology for critical science mission
Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.
Memory solutions matter for mission-critical applications. High-quality, high-reliability and ruggedness are key for aerospace and defense industry applications. Hear how Mercury and Micron...
Few technology applications are positioned to benefit from high-power RF GaN device insertion to the extent as space payloads.
We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.
Comparing Intel Xeon server-class processors for Space Time Adaptive Processing (STAP) applications.
This white paper describes AI and cognitive computing (CC) and introduces the underlying largely commercially developer IP that enables them.
GaN-based power amplifiers are ideal choice when your program requires high power, at high frequencies and in a small space.
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
In order to minimize cost and time-to-market, the hardware must be flexible and modular. To address this emerging-need, we have developed a multi-channel, coherent system architecture.
An overview of Mercury’s broad RF, microwave and mixed-signal solutions including compact components and highly integrated, modular assemblies.