Starting at chip scale with a trusted portfolio of microelectronic packaging capabilities is essential for advanced edge computing. Whether processing high volumes of radar data in the nose of a fighter jet, powering the latest UAVs or safely operating self-driving cars, an increasing number of applications rely on processing technology at the sensor edge, far from the data center.
Delivering the latest technology to these challenging environments is a major undertaking. The hardware must utilize the same semiconductor technology that powers commercial data centers but in a compact and rugged form factor. Additionally, a trusted supply chain and proven processes are essential for mission-critical applications.