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Tech Brief: Rugged Embedded Packaging and Next-Generation Cooling

January 28, 2020

Off-the-shelf packaging and cooling technologies for embedded aerospace and defense applications.

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Product Guide: EnsembleSeries OSA Sensor Processing
Product Guide: EnsembleSeries OSA Sensor Processing

Many of our embedded sensor processing solutions support built-in MOTS+ for extreme ruggedness and BuiltSEC...

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White Paper:  Accurate FPGA Power Modeling
White Paper: Accurate FPGA Power Modeling

Maximizing FPGA processing and channel density in SWaP-constrained EW applications through accurate thermal...

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