SWaP-optimized and ruggedized for operation in harsh environments, learn how Mercury ’s ACAP-based solutions will bring new levels of application capability to the tactical edge.
Learn how Mercury builds products with varying degrees of enhanced durability to operate under extreme envi...
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Optimized to solve the most advanced radar, cognitive EW and AI challenges, learn how Mercury ’s ACAP-engineer-to-engineer designer’s journey is intended to assist other development teams as they
Learn about the SOSA Consortium and the VITA organization, how they interact to address challenges and define successful strategies, along with illustrative examples of SOSA-aligned products.
Learn how Mercury builds products with varying degrees of enhanced durability to operate under extreme environmental conditions, including repeated temperature cycling over wide temperature ranges.
Learn how Mercury and Intel collaborate to scale and deploy composable data center capabilities across the fog and edge layers with high performance embedded computing (HPEC)
Assurance of DAL flight-safety certification and systems security engineering (SSE) is required to protect systems and mitigate risk for future smart and autonomous platforms
Discover how technologies developed by Mercury Systems and NVIDIA scale the best AI-enabling data center processing capabilities to the edge for real-time decision-making.
Cloud-scalable cross-domain solution methodologies, challenges and implementations for rapid, secure and correct information transfer between multiple security domains.
Modern sensors and AI need powerful flight-ready computing, but creating safe multi-core processing systems is difficult to achieve. Learn why Intel-based solutions are suited for AI and FVL.
Today's space imaging systems require radiation-tolerant NAND flash components with advanced error correction, packaged in lightweight, rugged VPX form factors.
Artificial Intelligence (AI) is rapidly transforming the defense industry by broadening the scope of machine applications and leveling the playing field for nation states looking to gain power.
Enterprises supporting the DoD can leverage commercial investment, open systems architectures and internal R&D to speed technology innovation and reduce overall sustainment and investment cost.
Rappid: A modular, application-ready spectrum processing platform
PCIe Gen 4 technologies increase application efficiency by eliminating bottlenecks and increasing throughput for multi-domain, compute-intensive applications at the edge.
This whitepaper discusses how new holistic systems security engineering and flight-safety certification design approaches are enabling smarter platforms to be deployed anywhere.
This paper first discusses advanced capabilities that enhance LCD technology and then reviews business factors to consider when selecting or specifying display systems.
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
Technology is evolving faster than ever. Mercury's business model leverages open standards, commercial technology and R&D investment to drive innovation at a lower cost.
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.