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XR6 RES HD Modules

The newest generation RES XR6 HD modules integrate the latest Intel Xeon Scalable processors to deliver superior workload-optimized performance and hardware-enhanced security in a smaller footprint. Designed for mission critical applications outside the data center, all modules meet or exceed military specifications - incorporating advanced thermal and mechanical design features to provide enhanced reliability with superior resiliency to shock, vibration, and temperature extremes.


Long Term Sustainability

Themis RES-HD and HDSlim chassis accommodate previous, current and future RES HD modules.

 


XR6 RES HD Module Specifications

High Density Fabric Extender (HDFE)

Designed to alleviate the challenges associated with transferring and accessing data across geo-diverse locations, the HDFE offers predictable, distance-independent performance with the HDFE module and MaxDX™ software. Access or transfer large amounts of data up to 75x faster than TCP/IP at 10G/30,000km.

System

  • Software
    • Bay Microsystem’s MaxDX
  • Processor
    • Intel Xeon E5-2600 v3/v4 series with 20 cores
  • Switching
    • 120Gbps non-blocking switch capacity
  • Interface
    • Two 4X FDR InfiniBand QSFP+ ports;
    • Two 40GE QSFP+ ports; Six 1/10GE SFP+ ports
  • Fabric Reach
    • Round Trip Time (RTT) of 2500ms @10Gbps, 625ms @ 40G

Benefits

  • Streamlined distributed workflows with predictable data access and sharing
  • Accelerated workloads and reduced application run times
  • Operational efficiency with maximum  bandwidth usage and minimal data replication
  • Capital preservation by leveraging existing infrastructure
  • Minimal downtime and seamless business continuity with predictable data copy, back-up and disaster recovery for
  • Easy to understand intuitive software with a web-based management interface

 

XR6 High Density Compute (HDC)

Occupies one RES HD chassis slot

System

  • Processor
    • 1 Intel Xeon Scalable Processor up to 22 cores, 44 threads**
  • Memory
    • Up to 1TB DDR4 ECC 2666MHz, 16 DIMM
  • Disk on Module
    • Up to 128GB per DOM

Input/Output

  • USB 3.0 Ports
    • 2 Front
  • VGA
    • 1 Front
  • Ethernet Ports (RJ45)
    • Front. Multiple Ethernet Options including 1GBaseT, 10G Eth / SFP+, 10GBaseT, 25Gbps SFP28, 56Gbps (QSFP), 100Gbps (QSFP28)
  • Serial Port
    • 1 Front (optional)

XR6 High Density Storage (HDS) Module Options

There are multiple storage module options, with common specifications listed below. Secure storage options are also available. A configured 2U or HDslim server can deliver four Intel Xeon Scalable Processors and 720TB of storage with 24 direct attached HDD/SSD drives. HDS4 and HDS8 modules occupy two RES HD chassis slots each, HDSE occupies a single slot.

System

  • Processor
    • 1 Intel® Xeon® Scalable Processor up to 22 cores, 44 threads**
  • Memory
    • Up to 1TB DDR4 ECC 2666MHz, 16 DIMM
  • Disk on Module
    • 2 Up to 128GB per DOM

Input/Output

  • USB 3.0 Ports
    • 2 Front
  • VGA
    • 1 Front
  • Ethernet Ports (RJ45)
    • 4 Front. Multiple Ethernet Options including 1GBaseT, 10G Eth / SFP+, 10GBaseT, 25Gbps SFP28, 56Gbps (QSFP), 100Gbps (QSFP28)
  • Serial Port
    • 1 Front (optional)

High Density Storage (HDS4)

  • Storage:
    • 4 front-access SATA, SAS3 or U.2 storage drives for up to 120TB of storage
  • Expansion:
    • low/high profile, half length cards
    • Front I/O: up to 2 PCiE 3.0×16 + 1 PCie 3.0×8
    • Rear I/O: 2 PCiE 3.0×16 + 1 PCie 3.0×8 or 1 PCiE 3.0×16 + 3 PCie 3.0×8

High Density Storage (HDS8)

  • Storage:
    • 8 SATA or SAS3 drives for up to 240TB of storage
  • Expansion:
    • low/high profile, half length cards
  • Front I/O:
    • up to 2 PCiE 3.0×16
  • Rear I/O:
    • up to 1 PCiE 3.0×16 + 2 PCie 3.0×8

High Density Storage Expansion (HDSE)

  • Storage:
    • 8 SATA or SAS3 drivesfor up to 240TB of storage
  • Requirements:
    • special rear I/O configurations

XR6 High Density PCIe Expansion (HDP) Module

The latest XR6 HDP module accommodates the latest NVIDIA® Quadro or Tesla graphics card for supercomputing and virtualization applications. Each configured HDP module can integrate one GPGPU. Other PCIe expansion options are available. Each HDP module occupies two RES HD chassis slots.

System

  • Processor
    • 1 Intel® Xeon® Scalable Processor up to 22 cores, 44 threads**
  • Memory
    • Up to 1TB DDR4 ECC 2666MHz, 16 DIMM
  • Disk on Module
    • 2 Up to 128GB per DOM
  • PCIe Expansion
    • up to 5
    • Options
      • double wide PCiE 3.0×16 (eg. TESLA GPGPU) 2 PCIe 3.0×16, low profile, half length cards
      • PCIe 3.0 x 8, 1 PCIe 3.0, low profile, half length cards
      • PCIe 3.0×16 low profile, half length cards & 2 PCIe 3.0×8 full height, full length cards

Input/Output

  • USB 3.0 Ports
    • 2 Front
  • VGA
    • 1 Front
  • Ethernet Ports (RJ45)
    • 4 Front. Multiple Ethernet Options including 1GBaseT, 10G Eth / SFP+, 10GBaseT, 25Gbps SFP28, 56Gbps (QSFP), 100Gbps (QSFP28)
  • Serial Port
    • 1 Front (optional)

High Density Networking (HDN) – Managed Switch Modules

There are multiple managed switch modules available for RES HD servers: 1Gbps (HDN1), 40Gbps, 56Gbps IB (HDN40, HDN56) and 100Gbps (HDN100) managed switches. HDN switch modules occupy one RES HD chassis slot.

1GBe Ethernet Switch (HDN1)

Switch

  • Switch Ethernet Ports
    • 16 1GbE (RJ45)
  • Other Ports (RJ45)
    • 2 (1) Serial (1) Ethernet Management
  • Network
    • Layer 2/3

Features

  • Routing
    • IPv4/IPv6: IP Multicast, VLANs, IETF, IEEE, DSL Forum
  • Quality of Service (QoS)
    • IEEE 802.1p priority tagging, DSCP, traffic queues
  • Management
    • Ethernet (http, telnet, SNMP) and RS232 (CLI)

Functionality:

48Gbps performance switching capacity
35.71 Mpps maximum forwarding rate
8K entries MAC address table size
3.5Mbits Packet Buffer Forwarding mode: store and forward
Supports half/full duplex operation at 10/100Mbps
Supports port auto-negotiation

10GbE, 40GbE, 56GbE IB (HDN40, HDN56)

Switch

  • Switch Ethernet Ports
    • 12 56Gb IB, 40GbE, 10GbE VPI switched ports
  • Other Ports (RJ45)
    • 2 Serial + Ethernet Management

Features

  • Throughput
    • Non-blocking bidirectional, 1.344 Tb/s
  • Latency
    • 200ns (56Gb IB), 220ns (40GbE), 270ns (10GbE)
  • Network
    • Layer 2/3 (10GbE, 40GbE) feature set

56Gb IB Features:

CLI or SNMP Management, IBTA 1.21 and 1.3 Compliancy
9 Virtual Lanes (8 data + 1 management)
256 to 4Kbyte MTU, 4x48K entry linear forwarding data base
On-board SM for fabrics up to 648 nodes
Management ports: 100/1000 Ethernet, RS232 port over DB9, miniUSB

100GbE Switch (HDN100)

The HDN100 switch is currently only available for HDslim chassis configurations.

  • Switch Ethernet Ports
    • 22 18 SFP+/SFP28 10/25GbE + 4 splittable QSFP+/QSFP28 40/100GbE ports
  • Other Ports (RJ45)
    • 2 Serial + Ethernet Management

Features

  • Throughput
    • Non-blocking bidirectional, 1.7 Tb/s
  • Latency
    • 300ns for 100GbE, consistent latency

Layer 2/3 Features

10/25/40/50/56/100GbE
Multi chassis LAG (MLAG) 802.1W rapid spanning tree 802.1Q
multiple STP 802.3 ad Link Aggregation (LAG) & LACP
Jumbo frames (9216 Bytes)
IPv4 & IPv6 route maps including BGP4
OSPFv2 BFD (BGP, OSPF, static routes)
DHCPv4/v6 Relay Router port, int VLAN
NULL interface for routing

Network Virtualization

VXLAN Hardware VTEP-L2 GW
Integration with VMware NSX, Openstack and more

Software Defined Storage (SDN):

Openflow 1.3 (hybrid, supported controllers)

Security:

US APL Department of Defense Certification
System secure mode: FIPS 140-2 Compliance
Access Control Lists (ACLs L2-L4 & user defined)
802.1X Port based access control
SSH server restrict mode – NIST 800-181A
CoPP (IP filter), port isolation, storm control

High Density Resource Management (HDRM)

Occupies one RES HD chassis slot

  • Processor
    • 1 Intel i5-5300U vPro Processor
  • Server Management
    • IPMI 21.0, Zabbix, Web Based Interface
  • Managed IPMI Ports
    • 16 1GbE (RJ45)
  • Other Ports
    • 2 1 Management Console, 1 Serial
  • Compliancy
    • IEEE 802.3, 802.3u, 802.3ab IEEE 802.3x flow control support

High Density Fabric Extender (HDFE)

Designed to alleviate the challenges associated with transferring and accessing data across geo-diverse locations, the HDFE offers predictable, distance-independent performance with the HDFE module and MaxDX™ software. Access or transfer large amounts of data up to 75x faster than TCP/IP at 10G/30,000km.

System

  • Software
    • Bay Microsystem’s MaxDX™
  • Processor
    • 2 Intel Xeon E5-2600 v3/v4 series with 20 cores
  • Switching
    • 120Gbps non-blocking switch capacity
  • Interface
    • Two 4X FDR InfiniBand QSFP+ ports;
    • Two 40GE QSFP+ ports; Six 1/10GE SFP+ ports
  • Fabric Reach
    • Round Trip Time (RTT) of 2500ms @10Gbps, 625ms @ 40G

Benefits:

  • Streamlined distributed workflows with predictable data access and sharing
  • Accelerated workloads and reduced application run times
  • Operational efficiency with maximum bandwidth usage and minimal data replication
  • Capital preservation by leveraging existing infrastructure
  • Minimal downtime and seamless business continuity with predictable data copy, back-up and disaster recovery
  • Easy to understand intuitive software with a web-based management interface