As a global provider of advanced embedded components for defense markets and applications including extended environment operational requirements, Mercury, is Defense Microelectronics Activity (DMEA) accredited.
Mercury offers full design, fabrication, and test capabilities for simple to complex custom Multi-Chip Packages (MCPs) , Commercial-Off-The-Shelf (COTS) memory, processors and combination MCPs for demanding defense applications.
Mercury delivers quality through procedures, policies, documentation and continuous improvement:
For optimized size, weight and power (SWaP), Mercury designs, qualifies and miniaturizes electronic systems for severe defense and aerospace environments. Our packaging technologies provide huge space savings in applications that don't have enough physical room for traditional approaches. Mercury high-density multi-chip package and system-in-a-package solutions not only free up board space and reduce I/Os, they also provide advantages in performance, integration, cost and obsolescence management. Mercury is one of the foremost experts in designing extended environment, high-reliability, high-density electronics, including die stacking, that provide more computing power per square inch. Mercury offers full-service design, assembly, test and ruggedization capabilities.
Mercury is focused on serving our customers with unsurpassed responsiveness and technical expertise. We offer a wide range of services designed to deliver the best combination of technology, products and support to our customers.