WF1M32B-XH1X3

Docs & Specs

Data Sheet

Application Notes

Overview

Model:  WF1M32B-XH1X3
32Mb 1Mx32 3.3V NOR Flash Module

Features

  • Access Times of 100, 120, 150ns
  • Packaging
    • 66 pin, PGA Type (H1), 1.075" square, Hermetic Ceramic HIP (Package 404)
  • 100,000 Erase/Program Cycles Minimum
  • Sector Architecture
    • One 16KByte, two 8KBytes, one 32KByte, and fifteen 64kBytes (each chip)
    • Any combination of sectors can be concurrently erased. Also supports full chip erase
  • Organized as 1Mx32
  • Commercial, Industrial, and Military Temperature Ranges
  • 3.3 Volt for Read and Write Operations
  • Low Power CMOS
  • Embedded erase and program algorithms
  • Built-in Decoupling Caps for Low Noise Operation
  • Erase Suspend/Resume
    • Supports reading data from or programing data to a sector not being erased
  • Low Current Consumption
  • Typical values at 5MHz
    • 40mA Active Read Current
    • 80mA Program/Erase Current
  • Weight:  WF1M32B-XH1X3 -13 grams typical

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