Docs & Specs

Data Sheet

Application Notes


Model:  WF512K32N-XH1X5
16Mb 512Kx32 5V NOR Flash Module (SMD 5962-94612)


  • Access Times of 60, 70, 90, 120, 150ns
  • Packaging
    • 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (H2) (Package 400).
    • 68 lead, 40mm, Low Profile 3.5mm (0.140"), CQFP (Package 502)1
    • 68 lead, 22.4mm (0.880") Low Profile CQFP (G2U) 3.5mm (0.140") high, (Package 510)
    • 68 lead, 22.4mm (0.880") CQFP (G2L) 5.08mm (0.200") high, Package (528)
  • 100,000 Erase/Program Cycles Minimum
  • Sector Architecture
    • 8 equal size sectors of 64KBytes each
    • Any combination of sectors can be concurrently erased. Also supports full chip erase
  • Organized as 512Kx32
  • Commercial, Industrial, and Military Temperature Ranges
  • 5 Volt Read and Write
  • Low Power CMOS
  • Embedded erase and program algorithms
  • TTL compatible inputs and CMOS outputs
  • Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation.
  • Page program operation and internal program control time
  • Weight:  WF512K32N-XH1X5 - 13 grams typical

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